Printed board temperature impact test conditions and evaluation methods
At present, the common temperature impact test and evaluation methods for printed boards are as follows. Comparing the test conditions in each standard, it can be seen that they all select the test temperature, cycle and other conditions according to different substrates and actual working environment. . In addition to the general standards, many companies will also develop more detailed internal enterprise standards based on common standards, and flexibly adjust the test conditions for different products and applications. For example, in the test evaluation for package substrates, the number of cycles is often increased to 500. -1000 to ensure long-term reliability of future products.
Printed board temperature impact test conditions and evaluation methods:
National military standards: GJB362B-2009 according to different substrate types. Four test conditions of A, B, C, and D are specified: low temperature -40 ° C / -55 ° C / -65 ° C, high temperature 85 ° C / 125 ° C / 150 ° C / 170 ° C, each placed for 15 min, 100 cycles. Evaluation basis: The resistance change measured at the first and last high temperature of GJB362B-2009 should be less than 10%. Micro-section evaluation of the plated holes should be performed after the test.
National aerospace industry standard: QJ519A and QI832A low temperature -65 ° C, high temperature 125 ° C, each placed for 15 min, 100 cycles, the conversion time is less than 1 min. Evaluation basis: The difference between the interconnect resistance value after the first cycle of QJ201A and QI831A and the interconnect resistance value after the last cycle is not more than 10% of the interconnect resistance value after the first cycle. After the test, the microscopic part of the plated hole should be evaluated.
IPC standard: IPC-TM-650 2.6.7 Printed board temperature impact According to different substrate types, four test conditions of A, B, C, D, E, F are specified: low temperature 0 °C / -40 °C / - 55 ° C / -65 ° C, high temperature 70 ° C / 85 ° C / 105 ° C / 125 ° C / 150 ° C / 170 ° C, each placed for 15 min, 100 cycles. Evaluation basis: IPC-6012B resistance change rate should be less than 10%, micro-section evaluation of plated holes should be carried out after the test.
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