Leading semiconductor packaging material supplier Rohmand Haas Electronic Materials has signed a joint development agreement with IBM to develop and evaluate new materials for emerging packaging technologies.
The agreement will focus on the evaluation of photoresist materials and support aids for IBM's 3D packaging technology, and low-temperature photosensitive dielectric materials. Rohm and Haas and IBM will also develop new materials for wafer level and capillary bottom applications.
David Schram, Director of packaging and processing technology at Rohm and Haas Electronic Materials, stated: “We are very excited to have the opportunity to work closely with leading companies in the semiconductor market. IBM and Rohm and Haas have a long history of developing new materials together. Meet the needs of the next generation of products in the electronics industry. I'm sure this agreement will solve the key obstacles in the design of semiconductor packages."
The new generation of 3D semiconductor packages poses many challenges to shrinking form factor, enhanced energy management requirements, and complex packaging plans that require new materials to solve. Leo Linehan, director of advanced packaging business development and marketing at Rohm and Haas Electronic Materials, said: “The emerging three-dimensional packaging requires the development of new materials and processes to address many new technical hurdles, including penetrating silicon channels and packaging high-performance silicon devices. The company is a major reformer in packaging technology and through this partnership with IBM will ensure that Rohm and Haas is known as a leading supplier of advanced packaging materials in the industry."