Low temperature curing epoxy adhesive
Component dosage /g component dosage /g
A, 600# diglycidyl ether 100 aluminum powder 8
E-20 Epoxy 40 Quartz Powder 40
Reagents of 621# polyhydroxy polyether 10 B, boron trifluoride ether, tetrahydrofuran and phosphoric acid
A: B=2: (0.075-0.1)
Preparation and curing Weigh in order and mix well. After exposure to pressure, -15 °C 6h, up to 80% of strong sense. - Maximum strength at -15°C for 24 hours.
Use This adhesive is used for outdoor bonding in winter.
2# cryogenic glue
Component dosage /g component dosage /g
A,E-53 epoxy resin modified polyurethane 100 B,3,3 dichloro-4,4 diamino diphenyl methane 20
Preparation and solidification pot life: 6g, 20 °C, 30-40min; curing: pressure of 0.02MPa, 60 °C 1h, 100 °C under 2-4h.
Use The glue is used at -196-100°C for bonding and sealing of aluminum, copper, steel and other metals and their alloys.
DOO-1 glue
Component dosage /g component dosage /g
Polyurethane prepolymer 100 A-187 (trihydroxypropane/butanediol = 1:1) 1.5
Calcium carbonate 40
Preparation and curing Room temperature curing.
Use The glue is used for low temperature bonding.
DOO-2 glue
Component dosage /g component dosage /g
Polyurethane prepolymer 100 A187 (trihydroxypropane/butanediol = 1:1) 1.5
Preparation and curing Heatable or room temperature curing.
Use The glue is used for low temperature bonding.
Ultra-low temperature 1# glue
Component dosage /g component dosage /g
Trihydroxypropylene oxide/toluene diisocyanate prepolymer 100 reform, 3 dichloro-4,4 diaminodiphenylmethane 20
Prepare and cure at 0.02 MPa pressure and cure at 100°C for 4 h.
Use The glue is used for ultra-low temperature bonding and oxygen generator repair.
Epoxy-polyurethane ultra-low temperature adhesive
Component dosage /g component dosage /g
E-51 Epoxy Resin 100 Polyurethane Pre-Polymer 60
Ethyl-4-methyl imidazole 4 aluminum powder 6
Preparation and curing According to the recipe, all materials can be mixed and used. After bonding, curing was performed at 100°C for 4 hours.
Use The glue has good flexibility, in the range of -190°C room temperature, it has good bonding strength to most materials, and is mainly used for bonding of low temperature containers.
Source: 21st Century Fine Chemicals Network